42 search results - page 6 / 9 » On the Power Management of Simultaneous Multithreading Proce... |
EGH
2004
Springer
14 years 1 months ago
2004
Springer
The real time 3D graphics becomes one of the attractive applications for 3G wireless terminals although their battery lifetime and memory bandwidth limit the system resources for ...
TCAD
2008
13 years 7 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
DAC
2006
ACM
14 years 8 months ago
2006
ACM
With ever-increasing power density and cooling costs in modern high-performance systems, dynamic thermal management (DTM) has emerged as an effective technique for guaranteeing th...
EUROSYS
2007
ACM
14 years 4 months ago
2007
ACM
The major chip manufacturers have all introduced chip multiprocessing (CMP) and simultaneous multithreading (SMT) technology into their processing units. As a result, even low-end...
MICRO
2009
IEEE
14 years 2 months ago
2009
IEEE
Many-core scaling now faces a power wall. The gap between the number of cores that fit on a die and the number that can operate simultaneously under the power budget is rapidly i...