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ISCAS
2006
IEEE
112views Hardware» more  ISCAS 2006»
14 years 1 months ago
Fine-grain thermal profiling and sensor insertion for FPGAs
– Increasing logic densities and clock frequencies on FPGAs lead to rapid increase in power density, which translates to higher on-chip temperature. In this paper, we investigate...
Somsubhra Mondal, Rajarshi Mukherjee, Seda Ogrenci...
INFOCOM
2005
IEEE
14 years 1 months ago
Exploiting heterogeneity in sensor networks
—The presence of heterogeneous nodes (i.e., nodes with an enhanced energy capacity or communication capability) in a sensor network is known to increase network reliability and l...
Mark D. Yarvis, Nandakishore Kushalnagar, Harkirat...
INFOVIS
2005
IEEE
14 years 1 months ago
Dynamic Visualization of Graphs with Extended Labels
The paper describes a novel technique to visualize graphs with extended node and link labels. The lengths of these labels range from a short phrase to a full sentence to an entire...
Pak Chung Wong, Patrick Mackey, Ken Perrine, James...
ISQED
2005
IEEE
98views Hardware» more  ISQED 2005»
14 years 1 months ago
Wire Planning with Bounded Over-the-Block Wires
Hierarchical approach greatly facilitates large-scale chip design by hiding distracting details in low-level objects. However, the lowlevel designs have to have a global view of h...
Hua Xiang, I-Min Liu, Martin D. F. Wong
ISPD
2005
ACM
140views Hardware» more  ISPD 2005»
14 years 1 months ago
Are floorplan representations important in digital design?
Research in floorplanning and block-packing has generated a variety of data structures to represent spatial configurations of circuit modules. Much of this work focuses on the g...
Hayward H. Chan, Saurabh N. Adya, Igor L. Markov