- By putting different chips on the same mask, shuttle mask (or multiple project wafer) provides an economical solution for low volume designs and design prototypes to share the ri...
Gang Xu, Ruiqi Tian, David Z. Pan, Martin D. F. Wo...
With the increasing levels of variability and randomness in the characteristics and behavior of manufactured nanoscale structures and devices, achieving performance optimization u...
This paper considers the utility of VR in the design of the interface to a space-based telerobotic manipulator. An experiment was conducted to evaluate the potential for improved ...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Community wireless mesh networks (WMNs) are increasingly being deployed for providing cheap, low maintenance Internet access. For the successful adoption of WMNs as a last-mile te...
Saumitra M. Das, Dimitrios Koutsonikolas, Y. Charl...