108 search results - page 7 / 22 » Performance and Power Impact of Issue-width in Chip-Multipro... |
HOTI
2008
IEEE
14 years 2 months ago
2008
IEEE
The Network-on-Chip (NoC) paradigm has emerged as a promising solution for providing connectivity among the increasing number of cores that get integrated into both systems-onchip...
HPCA
2006
IEEE
14 years 8 months ago
2006
IEEE
Simulation is an important means of evaluating new microarchitectures. Current trends toward chip multiprocessors (CMPs) try the ability of designers to develop efficient simulato...
TCAD
2008
13 years 7 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
ICCAD
2008
IEEE
14 years 4 months ago
2008
IEEE
In this paper, we propose a new architecture-level parameterized transient thermal behavioral modeling algorithm for emerging thermal related design and optimization problems for ...
HPCA
2007
IEEE
14 years 8 months ago
2007
IEEE
Chip multiprocessors with multiple simpler cores are gaining popularity because they have the potential to drive future performance gains without exacerbating the problems of powe...