In this paper, we propose a global routing algorithm for multi-layer building-block layouts. The algorithm is based on successive ripup and rerouting while satisfying edge capacit...
Advances in fabrication technology have resulted in a continual shrinkage of device dimensions. This has resulted in smaller device delays, greater resistance along interconnect w...
In this paper we present a new global router appropriate for Multichip Module MCM and dense Printed Circuit Board PCB design, which utilizes a hybrid of the classical rip-up and r...
A new approa ch for pe r f or ma nc e -dr ive n r outi ng i n hi ghly c onge st e d hi gh s pe e d MCMs a nd PCBs i s pr e s e nt e d. Gl oba l r out i ng i s e mpl oye d t o ma n...