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ICCD
2005
IEEE
221views Hardware» more  ICCD 2005»
14 years 4 months ago
Broadband Impedance Matching for Inductive Interconnect in VLSI Packages
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
Brock J. LaMeres, Sunil P. Khatri
RTAS
2010
IEEE
13 years 5 months ago
Using PCM in Next-generation Embedded Space Applications
Abstract--Dynamic RAM (DRAM) has been the best technology for main memory for over thirty years. In embedded space applications, radiation hardened DRAM is needed because gamma ray...
Alexandre Peixoto Ferreira, Bruce R. Childers, Ram...
ACMICEC
2005
ACM
156views ECommerce» more  ACMICEC 2005»
14 years 1 months ago
A web services-based business interactions manager to support electronic commerce applications
Electronic commerce applications (e-commerce) need connecting technologies to support the external, agreed-upon or flexible business processes. This requires a specification of th...
Youcef Baghdadi
DATE
2009
IEEE
146views Hardware» more  DATE 2009»
14 years 2 months ago
System-level power/performance evaluation of 3D stacked DRAMs for mobile applications
Abstract—Convergence of communication, consumer applications and computing within mobile systems pushes memory requirements both in terms of size, bandwidth and power consumption...
Marco Facchini, Trevor Carlson, Anselme Vignon, Ma...
HICSS
2003
IEEE
168views Biometrics» more  HICSS 2003»
14 years 29 days ago
'Pay-per-use' Concept in Healthcare: A Grounded Theory Perspective
Healthcare organizations worldwide are faced with the growing challenge of introducing structural and technological reforms and cost-effective IT solutions that will transform the...
Abdullah A. Akbar