Modern superscalar microprocessors need sizable register files to support large number of in-flight instructions for exploiting ILP. An alternative to building large register file...
Oguz Ergin, Deniz Balkan, Dmitry V. Ponomarev, Kan...
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
In this paper we present a family of multi-objective hypergraph partitioning algorithms based on the multilevel paradigm, which are capable of producing solutions in which both th...
We propose to introduce redundant interconnects for manufacturing yield and reliability improvement. By introducing redundant interconnects, the potential for open faults is reduc...
Modern organizations face increasingly complex information management requirements. A combination of commercial needs, legal liability and regulatory imperatives has created a pat...
Qing Zhang, John McCullough, Justin Ma, Nabil Sche...