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» Post-Layout Optimization for Deep Submicron Design
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TCAD
2002
99views more  TCAD 2002»
13 years 7 months ago
Analysis of on-chip inductance effects for distributed RLC interconnects
This paper introduces an accurate analysis of on-chip inductance effects for distributed interconnects that takes the effect of both the series resistance and the output parasitic ...
Kaustav Banerjee, Amit Mehrotra
DAC
1999
ACM
14 years 8 months ago
Soft Scheduling in High Level Synthesis
In this paper, we establish a theoretical framework for a new concept of scheduling called soft scheduling. In contrasts to the traditional schedulers referred as hard schedulers,...
Jianwen Zhu, Daniel Gajski
ICCAD
2003
IEEE
98views Hardware» more  ICCAD 2003»
14 years 4 months ago
Achieving Design Closure Through Delay Relaxation Parameter
Current design automation methodologies are becoming incapable of achieving design closure especially in the presence of deep submicron effects. This paper addresses the issue of ...
Ankur Srivastava, Seda Ogrenci Memik, Bo-Kyung Cho...
DAC
1999
ACM
13 years 12 months ago
Buffer Insertion with Accurate Gate and Interconnect Delay Computation
Buffer insertion has become a critical step in deep submicron design, and several buffer insertion/sizing algorithms have been proposed in the literature. However, most of these m...
Charles J. Alpert, Anirudh Devgan, Stephen T. Quay
ASPDAC
2008
ACM
104views Hardware» more  ASPDAC 2008»
13 years 9 months ago
Variability-driven module selection with joint design time optimization and post-silicon tuning
Abstract-- Increasing delay and power variation are significant challenges to the designers as technology scales to the deep sub-micron (DSM) regime. Traditional module selection t...
Feng Wang 0004, Xiaoxia Wu, Yuan Xie