3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
The multiple-supply voltage (MSV) design style has been extensively applied to mitigate dynamic-power consumption. The MSV design paradigm, however, brings many crucial challenges...
Thermal effects are becoming a limiting factor in highperformance circuit design due to the strong temperaturedependence of leakage power, circuit performance, IC package cost and...
Zhijian Lu, Wei Huang, John Lach, Mircea R. Stan, ...
Abstract. In this paper, we propose an efficient method for finding consistent correspondences between two sets of features. Our matching algorithm augments the discriminative pow...
Composite (or Complex) event processing (CEP) systems search sequences of incoming events for occurrences of userspecified event patterns. Recently, they have gained more attentio...