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» Power Estimation in Sequential Circuits
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GLVLSI
2006
IEEE
119views VLSI» more  GLVLSI 2006»
14 years 2 months ago
Thermal analysis of a 3D die-stacked high-performance microprocessor
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
Kiran Puttaswamy, Gabriel H. Loh
ISPD
2009
ACM
112views Hardware» more  ISPD 2009»
14 years 2 months ago
Post-floorplanning power/ground ring synthesis for multiple-supply-voltage designs
The multiple-supply voltage (MSV) design style has been extensively applied to mitigate dynamic-power consumption. The MSV design paradigm, however, brings many crucial challenges...
Wan-Ping Lee, Diana Marculescu, Yao-Wen Chang
ICCAD
2004
IEEE
88views Hardware» more  ICCAD 2004»
14 years 4 months ago
Interconnect lifetime prediction under dynamic stress for reliability-aware design
Thermal effects are becoming a limiting factor in highperformance circuit design due to the strong temperaturedependence of leakage power, circuit performance, IC package cost and...
Zhijian Lu, Wei Huang, John Lach, Mircea R. Stan, ...
ACCV
2009
Springer
14 years 2 months ago
A Probabilistic Model for Correspondence Problems Using Random Walks with Restart
Abstract. In this paper, we propose an efficient method for finding consistent correspondences between two sets of features. Our matching algorithm augments the discriminative pow...
Tae Hoon Kim, Kyoung Mu Lee, Sang Uk Lee
SIGMOD
2009
ACM
202views Database» more  SIGMOD 2009»
14 years 8 months ago
ZStream: a cost-based query processor for adaptively detecting composite events
Composite (or Complex) event processing (CEP) systems search sequences of incoming events for occurrences of userspecified event patterns. Recently, they have gained more attentio...
Yuan Mei, Samuel Madden