979 search results - page 54 / 196 » Power Macromodeling for High Level Power Estimation |
GLOBECOM
2007
IEEE
14 years 2 months ago
2007
IEEE
— Optimal pilot design and placement for channel estimation in Multiple-input Multiple-output (MIMO) Orthogonal Frequency-Division Multiplexing (OFDM) systems in the presence of ...
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
ITC
2002
IEEE
14 years 21 days ago
2002
IEEE
Significant reductions in test application times can be achieved through parallelizing core tests; however, simultaneous test of various cores may result in exceeding power thres...
AINA
2007
IEEE
14 years 2 months ago
2007
IEEE
Continuous improvements in integration scale have made major microprocessor vendors to move to designs that integrate several processor cores on the same chip. Chip-multiprocessor...
DAC
1999
ACM
14 years 3 days ago
1999
ACM
Dynamic power consumed in CMOS gates goes down quadratically with the supply voltage. By maintaining a high supply voltage for gates on the critical path and by using a low supply...