101 search results - page 12 / 21 » Power Performance Thermal Design-Space Exploration for Multi... |
DATE
2006
IEEE
14 years 1 months ago
2006
IEEE
The power density inside high performance systems continues to rise with every process technology generation, thereby increasing the operating temperature and creating “hot spot...
VLSI
2012
Springer
12 years 3 months ago
2012
Springer
e technique is based on abstract execution profiles, called event signatures, and it operates at a higher level of abstraction than, for example, commonly used instruction-set sim...
HPCA
2008
IEEE
14 years 8 months ago
2008
IEEE
The trend towards integrating multiple cores on the same die has accentuated the need for larger on-chip caches. Such large caches are constructed as a multitude of smaller cache ...
CODES
2011
IEEE
12 years 7 months ago
2011
IEEE
Today, mobile smartphones are expected to be able to run the same complex, memory-intensive applications that were originally designed and coded for general-purpose processors. Ho...
DATE
2002
IEEE
14 years 18 days ago
2002
IEEE
In programmable embedded systems, the memory subsystem represents a major cost, performance and power bottleneck. To optimize the system for such different goals, the designer wou...