Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
With the scaling of technology and higher requirements on performance and functionality, power dissipation is becoming one of the major design considerations in the development of...
Jia Yu, Wei Wu, Xi Chen, Harry Hsieh, Jun Yang 000...
During the past few years, embedded digital systems have been requested to provide a huge amount of processing power and functionality. A very likely foreseeable step to pursue th...
Virtualization has been rapidly expanding its applications in numerous server and desktop environments to improve the utilization and manageability of physical systems. Such prolif...
Architecture description languages are widely used to perform architecture exploration for application-driven designs, whereas the RT-level is the commonly accepted level for hard...
Oliver Schliebusch, Anupam Chattopadhyay, Rainer L...