101 search results - page 6 / 21 » Power Performance Thermal Design-Space Exploration for Multi... |
DAC
2006
ACM
14 years 8 months ago
2006
ACM
Pareto surfaces in the performance space determine the range of feasible performance values for a circuit topology in a given technology. We present a non-dominated sorting based ...
DAC
2007
ACM
14 years 8 months ago
2007
ACM
The trend to multi-core chip designs presents new challenges for design automation, while the increased reuse of components may offer solutions. This paper describes some of the k...
HPCA
2001
IEEE
14 years 8 months ago
2001
IEEE
With the increasing clock rate and transistor count of today's microprocessors, power dissipation is becoming a critical component of system design complexity. Thermal and po...
VLSID
2007
IEEE
14 years 8 months ago
2007
IEEE
Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional ...
DAC
2009
ACM
14 years 2 months ago
2009
ACM
It is known that temperature gradients and thermal hotspots affect the reliability of microprocessors. Temperature is also an important constraint when maximizing the performance...