41 search results - page 5 / 9 » Present and Future Needs of Free-Space Optical Interconnects |
NOCS
2010
IEEE
13 years 5 months ago
2010
IEEE
The number of cores present on-chip is increasing rapidly. The on-chip network that connects these cores needs to scale efficiently. The topology of on-chip networks is an importan...
ISCA
2006
IEEE
14 years 1 months ago
2006
IEEE
Improvements in semiconductor technology have made it possible to include multiple processor cores on a single die. Chip Multi-Processors (CMP) are an attractive choice for future...
ICDCS
2005
IEEE
14 years 1 months ago
2005
IEEE
The design of the access networks of next generation broadband wireless systems requires special attention in the light of changing network characteristics. In this paper, we pres...
ICC
2007
IEEE
14 years 1 months ago
2007
IEEE
—While transparent WDM optical networks become more and more popular as the basis of the Next Generation Internet (NGI) infrastructure, such networks raise many unique security i...
ISPD
1998
ACM
13 years 11 months ago
1998
ACM
In very deep-submicron VLSI, certain manufacturing steps – notably optical exposure, resist development and etch, chemical vapor deposition and chemical-mechanical polishing (CM...