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144
Voted
BIRTHDAY
2012
Springer
13 years 11 months ago
2012
Springer
3-D integration presents many new opportunities for architects and embedded systems designers. However, 3-D integration has not yet been explored by the cryptographic hardware com...
116
Voted
ICCD
2005
IEEE
16 years 17 days ago
2005
IEEE
As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
127
Voted
DATE
2009
IEEE
15 years 10 months ago
2009
IEEE
—Interconnect structures significantly contribute to the delay, power consumption, and silicon area of modern reconfigurable architectures. The demand for higher clock frequencie...
107
Voted
ASPDAC
2006
ACM
15 years 9 months ago
2006
ACM
- Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact...
100
Voted
ISCAS
2005
IEEE
15 years 9 months ago
2005
IEEE
—Real-time spatio-temporal VLSI 3D IIR digital filters may be used for imaging or beamforming applications employing 3D input signals from synchronously-sampled multi-sensor arra...