Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
Due to difficulties in distributing a single global clock signal over increasingly large chip areas, a globally asynchronous, locally synchronous design is considered a promising ...
We present a vector selection methodology for estimating the peak power dissipation in a CMOS logic circuit. The ultimate goal is to combine the speed of RT-level simulation with ...
The current trends in high performance integrated circuits are towards faster and more powerful circuits in the giga-hertz range and even further. As the more complex Integrated C...
John Mayega, Okan Erdogan, Paul M. Belemjian, Kuan...
Current electronic system design requires to be concerned with power consumption consideration. However, in a lot of design tools, the application power consumption budget is esti...