This paper is concerned with rank aggregation, the task of combining the ranking results of individual rankers at meta-search. Previously, rank aggregation was performed mainly by...
Yu-Ting Liu, Tie-Yan Liu, Tao Qin, Zhiming Ma, Han...
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
This paper considers the problem of altering an image by imperceptibly adding or removing pixels, for example, to fit a differently shaped frame with minimal loss of interesting ...
—Power consumption has emerged as the premier and most constraining aspect in modern microprocessor and application-specific designs. Gate sizing has been shown to be one of the...
Foad Dabiri, Ani Nahapetian, Miodrag Potkonjak, Ma...
modules can be handled in constraint graphs efficiently. This Floorplan area minimization is an important problem because many modules have shape flexibilities during the floorplan...
Fung Yu Young, Chris C. N. Chu, W. S. Luk, Y. C. W...