1947 search results - page 106 / 390 » Reconsidering power management |
ISCA
2006
IEEE
13 years 8 months ago
2006
IEEE
Power density continues to increase exponentially with each new technology generation, posing a major challenge for thermal management in modern processors. Much past work has exa...
KES
2004
Springer
14 years 1 months ago
2004
Springer
Leveraging the potential power of even small handheld devices able to communicate wirelessly requires dedicated support. In particular, collaborative applications need sophisticate...
INFOCOM
2005
IEEE
14 years 1 months ago
2005
IEEE
— In many devices, wireless network interfaces consume upwards of 30% of scarce portable system energy. Extending the system lifetime by minimizing communication power consumptio...
NOCS
2010
IEEE
13 years 6 months ago
2010
IEEE
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
ISCA
2007
IEEE
14 years 2 months ago
2007
IEEE
With increasing speed and power density, high-performance memories, including FB-DIMM (Fully Buffered DIMM) and DDR2 DRAM, now begin to require dynamic thermal management (DTM) a...