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108
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ICCAD
2005
IEEE
101views Hardware» more  ICCAD 2005»
15 years 11 months ago
Parameterized interconnect order reduction with explicit-and-implicit multi-parameter moment matching for inter/intra-die variat
In this paper we propose a novel parameterized interconnect order reduction algorithm, CORE, to efficiently capture both inter-die and intra-die variations. CORE applies a two-ste...
Xin Li, Peng Li, Lawrence T. Pileggi
89
Voted
VLSID
2002
IEEE
92views VLSI» more  VLSID 2002»
16 years 2 months ago
Electromigration Avoidance in Analog Circuits: Two Methodologies for Current-Driven Routing
Interconnect with an insufficient width may be subject to electromigration and eventually cause the failure of the circuit at any time during its lifetime. This problem has gotten...
Jens Lienig, Goeran Jerke, Thorsten Adler
INFOCOM
2008
IEEE
15 years 8 months ago
Connectivity-Based Localization of Large Scale Sensor Networks with Complex Shape
—We study the problem of localizing a large sensor network having a complex shape, possibly with holes. A major challenge with respect to such networks is to figure out the corr...
Sol Lederer, Yue Wang, Jie Gao
SIGGRAPH
2010
ACM
15 years 6 months ago
Popup: automatic paper architectures from 3D models
Paper architectures are 3D paper buildings created by folding and cutting. The creation process of paper architecture is often laborintensive and highly skill-demanding, even with...
Xian-Ying Li, Chao-Hui Shen, Shi-Sheng Huang, Tao ...
DAC
2012
ACM
13 years 4 months ago
A metric for layout-friendly microarchitecture optimization in high-level synthesis
In this work we address the problem of managing interconnect timing in high-level synthesis by generating a layoutfriendly microarchitecture. A metric called spreading score is pr...
Jason Cong, Bin Liu