In this paper we propose a novel parameterized interconnect order reduction algorithm, CORE, to efficiently capture both inter-die and intra-die variations. CORE applies a two-ste...
Interconnect with an insufficient width may be subject to electromigration and eventually cause the failure of the circuit at any time during its lifetime. This problem has gotten...
—We study the problem of localizing a large sensor network having a complex shape, possibly with holes. A major challenge with respect to such networks is to figure out the corr...
Paper architectures are 3D paper buildings created by folding and cutting. The creation process of paper architecture is often laborintensive and highly skill-demanding, even with...
Xian-Ying Li, Chao-Hui Shen, Shi-Sheng Huang, Tao ...
In this work we address the problem of managing interconnect timing in high-level synthesis by generating a layoutfriendly microarchitecture. A metric called spreading score is pr...