33 search results - page 4 / 7 » Register placement for high-performance circuits |
DAC
2009
ACM
13 years 11 months ago
2009
ACM
Structured ASICs have recently emerged as an exciting alternative to ASIC or FPGA design style as they provide a new trade-off between the high performance of ASIC design and low ...
ISPD
1998
ACM
13 years 12 months ago
1998
ACM
With the recent advent of deep sub-micron technology and new packaging schemes such as Multi-Chip Modules(MCMs), integrated circuit components are often not rectangular. Most exis...
FPGA
2009
ACM
14 years 2 months ago
2009
ACM
Carbon nanotubes (CNTs), with their unique electronic properties, are promising materials for building nanoscale circuits. In this paper, we present a new CNT-based FPGA architect...
DAC
2006
ACM
14 years 8 months ago
2006
ACM
Modern high performance processors employ advanced techniques for thermal management, which rely on accurate readings of on-die thermal sensors. As the importance of thermal effec...
ICCD
2006
IEEE
14 years 4 months ago
2006
IEEE
The placement of on-die decoupling capacitors (decap) between the power and ground supply grids has become a common practice in high performance processor designs. In this paper, ...