463 search results - page 35 / 93 » Reliability and Power Management of Integrated Systems |
DAC
2006
ACM
14 years 8 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
DATE
2010
IEEE
14 years 27 days ago
2010
IEEE
—Packaging becomes an important issue in aerospace equipments because of high integration and severe environmental constraints. In order to develop products which respond to the ...
VEE
2009
ACM
14 years 2 months ago
2009
ACM
r of high-level languages lies in their abstraction over hardware and software complexity, leading to greater security, better reliability, and lower development costs. However, o...
IADIS
2003
13 years 9 months ago
2003
Hypermedia systems (whether web sites or not) should support multilevel policiesm, offering different views and manipulation abilities of the same information to users with differ...
DAC
2010
ACM
13 years 8 months ago
2010
ACM
Many DTM schemes rely heavily on the accurate knowledge of the chip's dynamic thermal state to make optimal performance/ temperature trade-off decisions. This information is ...