282 search results - page 7 / 57 » Reliability- and process-variation aware design of integrate... |
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
TVLSI
2008
13 years 7 months ago
2008
Abstract--Technology scaling in the nanometer era has increased the transistor's susceptibility to process variations. The effects of such variations are having a huge impact ...
DATE
2010
IEEE
14 years 25 days ago
2010
IEEE
Abstract—Negative bias temperature instability (NBTI) significantly affects nanoscale integrated circuit performance and reliability. The degradation in threshold voltage (Vth) d...
SBCCI
2009
ACM
14 years 12 days ago
2009
ACM
Because of the aggressive scaling of integrated circuits and the given limits of atomic scales, circuit designers have to become more and more aware of the arising reliability and...
VLSID
2010
IEEE
13 years 6 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...