In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
—Presented are a methodology and a DFII-based tool for AC-stability analysis of a wide variety of closed-loop continuous-time (operational amplifiers and other linear circuits). ...
Abstract--Field-programmable gate-array (FPGA) logic synthesis and technology mapping have been studied extensively over the past 15 years. However, progress within the last few ye...