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» Scaling and Packing on a Chip Multiprocessor
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ISCA
2009
IEEE
152views Hardware» more  ISCA 2009»
14 years 5 months ago
Scaling the bandwidth wall: challenges in and avenues for CMP scaling
As transistor density continues to grow at an exponential rate in accordance to Moore’s law, the goal for many Chip Multi-Processor (CMP) systems is to scale the number of on-ch...
Brian M. Rogers, Anil Krishna, Gordon B. Bell, Ken...
ISCA
2010
IEEE
176views Hardware» more  ISCA 2010»
14 years 2 months ago
Forwardflow: a scalable core for power-constrained CMPs
Chip Multiprocessors (CMPs) are now commodity hardware, but commoditization of parallel software remains elusive. In the near term, the current trend of increased coreper-socket c...
Dan Gibson, David A. Wood
CASES
2006
ACM
14 years 4 months ago
High-level power analysis for multi-core chips
Technology trends have led to the advent of multi-core chips in the form of both general-purpose chip multiprocessors (CMPs) and embedded multi-processor systems-on-a-chip (MPSoCs...
Noel Eisley, Vassos Soteriou, Li-Shiuan Peh
CAL
2007
13 years 10 months ago
A Building Block for Coarse-Grain Optimizations in the On-Chip Memory Hierarchy
Current on-chip block-centric memory hierarchies exploit access patterns at the fine-grain scale of small blocks. Several recently proposed memory hierarchy enhancements for coher...
Jason Zebchuk, Andreas Moshovos
CODES
2007
IEEE
14 years 4 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick