Ever shrinking device sizes and innovative micro-architectural and circuit design techniques have made it possible to have multi-million transistor systems running at multi-gigahe...
Continuing VLSI technology scaling raises several deep submicron (DSM) problems like relatively slow interconnect, power dissipation and distribution, and signal integrity. Those ...
Rapid approximation of the transient response of high-speed global interconnects is needed to estimate the time delay, crosstalk, and overshoot in a GSI multilevel wiring network....
Raguraman Venkatesan, Jeffrey A. Davis, James D. M...
Three-dimensional Network-on-Chip (3-D NoC) is an emerging research topic exploring the network architecture of 3-D ICs that stack several smaller wafers for reducing wire length ...
Communication overheads are one of the fundamental challenges in a multiprocessor system. As the number of processors on a chip increases, communication overheads and the distribu...
Katherine E. Coons, Behnam Robatmili, Matthew E. T...