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DAC
2011
ACM
12 years 9 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
IJES
2008
130views more  IJES 2008»
13 years 9 months ago
Deriving efficient control in Process Networks with Compaan/Laura
: At Leiden Embedded Research Center (LERC), we are building a tool chain called Compaan/Laura that allows us to map rapidly and efficiently signal processing applications written ...
Steven Derrien, Alexandru Turjan, Claudiu Zissules...
PPDP
2005
Springer
14 years 3 months ago
Formal validation of pattern matching code
When addressing the formal validation of generated software, two main alternatives consist either to prove the correctness of compilers or to directly validate the generated code....
Claude Kirchner, Pierre-Etienne Moreau, Antoine Re...
CASES
2004
ACM
14 years 1 months ago
Reducing energy consumption of queries in memory-resident database systems
The tremendous growth of system memories has increased the capacities and capabilities of memory-resident embedded databases, yet current embedded databases need to be tuned in or...
Jayaprakash Pisharath, Alok N. Choudhary, Mahmut T...
LCPC
2005
Springer
14 years 3 months ago
A Language for the Compact Representation of Multiple Program Versions
Abstract. As processor complexity increases compilers tend to deliver suboptimal performance. Library generators such as ATLAS, FFTW and SPIRAL overcome this issue by empirically s...
Sébastien Donadio, James C. Brodman, Thomas...