Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
—In this paper, we consider joint optimization of end-to-end data transmission and resource allocation for Wireless-Infrastructured Distributed Cellular Networks (WIDCNs), where ...
Lei You, Ping Wu, Mei Song, Junde Song, Yong Zhang
We introduce a new theoretical derivation, evaluation methods, and extensive empirical analysis for an automatic query expansion framework in which model estimation is cast as a r...
Abstract. Support Vector Machines (SVM) have been applied successfully in a wide variety of fields in the last decade. The SVM problem is formulated as a convex objective function...
Data conflation is a major issue in GIS: spatial data obtained from different sources, using different acquisition techniques, needs to be combined into one single consistent d...