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» Spatially distributed 3D circuit models
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DATE
2009
IEEE
167views Hardware» more  DATE 2009»
14 years 1 months ago
Analyzing the impact of process variations on parametric measurements: Novel models and applications
Abstract—In this paper we propose a novel statistical framework to model the impact of process variations on semiconductor circuits through the use of process sensitive test stru...
Sherief Reda, Sani R. Nassif
VIS
2004
IEEE
124views Visualization» more  VIS 2004»
14 years 8 months ago
Constrained Inverse Volume Rendering for Planetary Nebulae
Determining the three-dimensional structure of distant astronomical objects is a challenging task, given that terrestrial observations provide only one viewpoint. For this task, b...
Charles D. Hansen, Gordon L. Kindlmann, Marcus A. ...
RECOMB
2004
Springer
14 years 7 months ago
Mining protein family specific residue packing patterns from protein structure graphs
Finding recurring residue packing patterns, or spatial motifs, that characterize protein structural families is an important problem in bioinformatics. To this end, we apply a nov...
Jun Huan, Wei Wang 0010, Deepak Bandyopadhyay, Jac...
JCNS
2010
119views more  JCNS 2010»
13 years 5 months ago
Disentanglement of local field potential sources by independent component analysis
The spontaneous activity of working neurons yields synaptic currents that mix up in the volume conductor. This activity is picked up by intracerebral recording electrodes as local ...
Valeri A. Makarov, Ioulia Makarova, Oscar Herreras
CCE
2007
13 years 8 months ago
A Web Services based Approach for System on a Chip Design Planning
: The concept of Virtual Organisation (VO) offers various solutions to management, collaboration and coordination issues important for distributed collaborating teams. Deployment o...
Maciej Witczynski, Edward Hrynkiewicz, Adam Pawlak