—Designing high-performance systems with high yield under parameter variations has raised serious design challenges in nanometer technologies. In this paper, we propose a profit-...
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
Abstract. The design flow of systems-on-a-chip (SoCs) identifies several abstraction levels higher than the Register-Transfer-Level that constitutes the input of the synthesis tool...
Claude Helmstetter, Florence Maraninchi, Laurent M...
Realization of high-performance domino logic depends strongly on energy-efficient and noise-tolerant interconnect design in ultra deep sub-micron processes. We characterize the c...
Ki-Wook Kim, Seong-Ook Jung, Unni Narayanan, C. L....
As timing requirements in today’s advanced VLSI designs become more aggressive, the need for automated tools to diagnose timing failures increases. This work presents two such a...
Jiang Brandon Liu, Magdy S. Abadir, Andreas G. Ven...