419 search results - page 9 / 84 » Synthesis of networks on chips for 3D systems on chips |
GLVLSI
2005
IEEE
14 years 2 months ago
2005
IEEE
3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
CASES
2010
ACM
13 years 6 months ago
2010
ACM
3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
DATE
2010
IEEE
14 years 12 days ago
2010
IEEE
Abstract—Supporting Distributed Shared Memory (DSM) is essential for multi-core Network-on-Chips for the sake of reusing huge amount of legacy code and easy programmability. We p...
ICCAD
2004
IEEE
14 years 5 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
SAC
2006
ACM
14 years 2 months ago
2006
ACM
The reduction of image reconstruction time is needed to spread the use of PET for research and routine clinical practice. In this purpose, this article presents a hardware/softwar...