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» Temperature-aware global placement
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ISPD
2000
ACM
145views Hardware» more  ISPD 2000»
13 years 11 months ago
A snap-on placement tool
The standard cell placement problem has been extensively studied in the past twenty years. Many approaches were proposed and proven e ective in practice. However, successful place...
Xiaojian Yang, Maogang Wang, Kenneth Eguro, Majid ...
ICCAD
2008
IEEE
97views Hardware» more  ICCAD 2008»
14 years 4 months ago
Guiding global placement with wire density
—This paper presents an efficient technique for the estimation of the routed wirelength during global placement using the wire density of the net. The proposed method identifie...
Kalliopi Tsota, Cheng-Kok Koh, Venkataramanan Bala...
ASPDAC
2006
ACM
116views Hardware» more  ASPDAC 2006»
14 years 1 months ago
A robust detailed placement for mixed-size IC designs
— The rapid increase in IC design complexity and wide-spread use of intellectual-property (IP) blocks have made the so-called mixed-size placement a very important topic in recen...
Jason Cong, Min Xie
ISPD
2005
ACM
249views Hardware» more  ISPD 2005»
14 years 27 days ago
APlace: a general analytic placement framework
We streamline and extend APlace, the general analytic placement engine based on ideas of Naylor et al. [7] and described in [3, 4, 5]. Previous work explored the adaptability of A...
Andrew B. Kahng, Sherief Reda, Qinke Wang
ISPD
2012
ACM
234views Hardware» more  ISPD 2012»
12 years 2 months ago
MAPLE: multilevel adaptive placement for mixed-size designs
We propose a new multilevel framework for large-scale placement called MAPLE that respects utilization constraints, handles movable macros and guides the transition between global...
Myung-Chul Kim, Natarajan Viswanathan, Charles J. ...