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CODES
2007
IEEE
14 years 2 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
IPPS
2007
IEEE
14 years 2 months ago
Load Miss Prediction - Exploiting Power Performance Trade-offs
— Modern CPUs operate at GHz frequencies, but the latencies of memory accesses are still relatively large, in the order of hundreds of cycles. Deeper cache hierarchies with large...
Konrad Malkowski, Greg M. Link, Padma Raghavan, Ma...
MICRO
2007
IEEE
150views Hardware» more  MICRO 2007»
14 years 2 months ago
Leveraging 3D Technology for Improved Reliability
Aggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower sup...
Niti Madan, Rajeev Balasubramonian
P2P
2007
IEEE
153views Communications» more  P2P 2007»
14 years 2 months ago
On Routing in Distributed Hash Tables
There have been many proposals for constructing routing tables for Distributed Hash Tables (DHT). They can be classified into two groups: A) those that assume that the peers are ...
Fabius Klemm, Sarunas Girdzijauskas, Jean-Yves Le ...
SASO
2007
IEEE
14 years 2 months ago
e-SAFE: An Extensible, Secure and Fault Tolerant Storage System
With the rapidly falling price of hardware, and increasingly available bandwidth, the storage technology is seeing a paradigm shift from centralized and managed mode to distribute...
Sandip Agarwala, Arnab Paul, Umakishore Ramachandr...