The number and magnitude of process variation sources are increasing as we scale further into the nano regime. Today's most successful response surface methods limit us to lo...
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
Approach Abstracts AltPSM Lithography Requirements for sub-100nm IC Design Domains Pradiptya Ghosh, Chung-shin Kang, Michael Sanie and David Pinto Numerical Technologies, 70 West P...
Pradiptya Ghosh, Chung-shin Kang, Michael Sanie, D...
Interconnect delay has become a critical factor in determining the performance of integrated circuits. Routing and buffering are powerful means of improving the circuit speed and ...
Recent work has shown that the use of switched current methods can provide an effective route to implementation of analog IC functionality using a standard digital CMOS process. Fu...