: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
According to the present state of the theory of the matroid matching problem, the existence of a good characterization to the size of a maximum matching depends on the behavior of ...
Many techniques for power management employed in advanced RTL synthesis tools rely explicitly or implicitly on observability don’t-care (ODC) conditions. In this paper we presen...
In this paper, we study the possibility of using logic defect-level prediction models to predict the detection behavior of statistical timing defects. We compare two known logic m...
Li-C. Wang, Angela Krstic, Leonard Lee, Kwang-Ting...
— Memory is one of the most important components to be optimized in the several phases of the synthesis process. ioral synthesis, a memory is viewed as an abstract construct whic...