High reliability against noise, low energy consumption and high performance are key objectives in the design of on-chip networks. Recently some researchers have considered the var...
Alireza Ejlali, Bashir M. Al-Hashimi, Paul M. Rosi...
Modern reconfigurable computing systems feature powerful hybrid architectures with multiple microprocessor cores, large reconfigurable logic arrays and distributed memory hierarch...
This short paper explores an implementation of a new technology called 3D die stacking and describes research activity at Intel. 3D die stacking is the bonding of two die either f...
Bryan Black, Donald Nelson, Clair Webb, Nick Samra
Low power hardware design for entropy coding of H.264/AVC baseline profile encoder is urgent for the increasing mobile applications. However, previous works are poor in the power...
Aggressive technology scaling to 45nm and below introduces serious reliability challenges to the design of microprocessors. Large SRAM structures used for caches are particularly ...
Amin Ansari, Shantanu Gupta, Shuguang Feng, Scott ...