104 search results - page 19 / 21 » Thermal Characterization and Thermal Management in Processor... |
PERCOM
2006
ACM
14 years 7 months ago
2006
ACM
The European project COMSON (Coupled Multiscale Simulation and Optimization in Nanoelectronics) is a Marie Curie RTN project that involves five partners from academia and three fr...
ICCAD
2008
IEEE
14 years 4 months ago
2008
IEEE
Abstract—On-chip power density and temperature are rising exponentially with decreasing feature sizes. This alarming trend calls for temperature management at every level of syst...
DSN
2009
IEEE
2009
IEEE
Processor reliability enhancement through compiler-directed register file peak temperature reduction
13 years 11 months ago
Each semiconductor technology generation brings us closer to the imminent processor architecture heat wall, with all its associated adverse effects on system performance and reliab...
MR
2007
13 years 7 months ago
2007
Damage pre-cursors based health management and prognostication methodology has been presented for electronic systems in harsh environments. The framework has been developed based ...
DAC
2008
ACM
14 years 8 months ago
2008
ACM
Temperature hot-spots have been known to cause severe reliability problems and to significantly increase leakage power. The register file has been previously shown to exhibit the ...