104 search results - page 3 / 21 » Thermal Characterization and Thermal Management in Processor... |
ISLPED
2009
ACM
14 years 2 months ago
2009
ACM
This paper presents an evaluation to determine the importance of the accurate thermal characterization for several elements of a semiconductor device. Specifically, it evaluates ...
ISPASS
2009
IEEE
14 years 2 months ago
2009
IEEE
In temperature-aware design, the presence or absence of a heatsink fundamentally changes the thermal behavior with important design implications. In recent years, chip-level infra...
NOCS
2010
IEEE
13 years 6 months ago
2010
IEEE
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
DAC
2008
ACM
14 years 8 months ago
2008
ACM
Recently, processor power density has been increasing at an alarming rate resulting in high on-chip temperature. Higher temperature increases current leakage and causes poor relia...
HPCA
2001
IEEE
14 years 8 months ago
2001
IEEE
With the increasing clock rate and transistor count of today's microprocessors, power dissipation is becoming a critical component of system design complexity. Thermal and po...