50 search results - page 3 / 10 » Thermal modeling and analysis of 3D multi-processor chips |
3DIC
2009
IEEE
14 years 15 days ago
2009
IEEE
- In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrica...
3DIC
2009
IEEE
14 years 2 months ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
DAC
2006
ACM
14 years 8 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
ICCAD
2004
IEEE
14 years 4 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
TCAD
2008
13 years 7 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...