50 search results - page 4 / 10 » Thermal modeling and analysis of 3D multi-processor chips |
CODES
2007
IEEE
14 years 1 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
ICCAD
2001
IEEE
14 years 4 months ago
2001
IEEE
This paper presents both compact analytical models and fast SPICE based 3-D electro-thermal simulation methodology to characterize thermal effects due to Joule heating in high per...
VLSID
2007
IEEE
14 years 7 months ago
2007
IEEE
Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional ...
DAC
1998
ACM
14 years 8 months ago
1998
ACM
As VLSI circuit speeds have increased, reliable chip and system design can no longer be performed without accurate threedimensional interconnect models. In this paper, we describe...
ASPDAC
2008
ACM
13 years 9 months ago
2008
ACM
The capability of predicting the temperature profile is critically important for timing estimation, leakage reduction, power estimation, hotspot avoidance and reliability concerns ...