16 search results - page 3 / 4 » Thermal-Aware 3D IC Placement Via Transformation |
60
Voted
DAC
2011
ACM
12 years 7 months ago
2011
ACM
Clock tree synthesis is one of the most important and challenging problems in 3D ICs. The clock signals have to be delivered by through-silicon vias (TSVs) to different tiers with...
ASPDAC
2008
ACM
13 years 9 months ago
2008
ACM
The capability of predicting the temperature profile is critically important for timing estimation, leakage reduction, power estimation, hotspot avoidance and reliability concerns ...
ICCAD
2010
IEEE
13 years 5 months ago
2010
IEEE
Through-silicon via (TSV) fabrication causes tensile stress around TSVs which results in significant carrier mobility variation in the devices in their neighborhood. Keep-out zone ...
ECCV
2010
Springer
13 years 9 months ago
2010
Springer
Abstract. This paper presents a method for determining the six-degreeof-freedom (DOF) transformation between a camera and a base frame of interest, while concurrently estimating th...
ICCAD
2007
IEEE
14 years 4 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...