1476 search results - page 237 / 296 » Three-dimensional integrated circuits |
ICCAD
2006
IEEE
14 years 7 months ago
2006
IEEE
The continuous minituarization of integrated circuits may reach atomic scales in a couple of decades. Some researchers have already built simple computation engines by manipulatin...
ICCAD
2005
IEEE
14 years 7 months ago
2005
IEEE
— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...
ICCAD
2004
IEEE
14 years 7 months ago
2004
IEEE
Traditional timing-driven placement considers only combinational delays and does not take into account the potential of subsequent sequential optimization steps. As a result, the ...
ICCAD
2002
IEEE
14 years 7 months ago
2002
IEEE
We investigate appropriate regimes for transmission line propagation of signals on digital integrated circuits. We start from exact solutions to the transmission line equations pr...
ICCAD
2002
IEEE
14 years 7 months ago
2002
IEEE
As the scale of system integration continues to grow, the on-chip communication becomes the ultimate bottleneck of system performance and the primary determinant of system archite...