1476 search results - page 282 / 296 » Three-dimensional integrated circuits |
ISPD
2010
ACM
14 years 3 months ago
2010
ACM
Thermal/power issues have become increasingly important with more and more transistors being put on a single chip. Many dynamic thermal/power management techniques have been propo...
DAC
2009
ACM
14 years 3 months ago
2009
ACM
Multicore SOCs rely on runtime thermal measurements using on-chip sensors for DTM. In this paper we address the problem of estimating the actual temperature of on-chip thermal sen...
ISPD
2009
ACM
14 years 3 months ago
2009
ACM
The multiple-supply voltage (MSV) design style has been extensively applied to mitigate dynamic-power consumption. The MSV design paradigm, however, brings many crucial challenges...
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
Abstract—Reliable and verifiable hardware, software and content usage metering (HSCM) are of primary importance for wide segments of e-commerce including intellectual property a...
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
In modern digital ICs, the increasing demand for performance and throughput requires operating frequencies of hundreds of megahertz, and in several cases exceeding the gigahertz r...