1476 search results - page 286 / 296 » Three-dimensional integrated circuits |
ISLPED
2004
ACM
14 years 2 months ago
2004
ACM
We present a novel temperature/leakage sensor, developed for high-speed, low-power, monitoring of processors and complex VLSI chips. The innovative idea is the use of 4T SRAM cell...
SENSYS
2004
ACM
14 years 2 months ago
2004
ACM
The enormous potential for wireless sensor networks to make a positive impact on our society has spawned a great deal of research on the topic, and this research is now producing ...
FPGA
2004
ACM
14 years 2 months ago
2004
ACM
As FPGA densities increase, partitioning-based FPGA placement approaches are becoming increasingly important as they can be used to provide high-quality and computationally scalab...
DATE
2003
IEEE
14 years 2 months ago
2003
IEEE
: Over the years, many design methodologies/tools and layout architectures have been developed for datapath-oriented designs. One commonly used approach for high-speed datapath des...
GLVLSI
2003
IEEE
14 years 2 months ago
2003
IEEE
FPGAs, because of their re-programmability, are becoming very popular for creating and exchanging VLSI intellectual properties (IPs) in the reuse-based design paradigm. Existing w...