1476 search results - page 294 / 296 » Three-dimensional integrated circuits |
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
TCAD
2011
13 years 2 months ago
2011
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
TVLSI
2010
13 years 2 months ago
2010
By storing more than one bit in each memory cell, multi-level per cell (MLC) NAND flash memories are dominating global flash memory market due to their appealing storage density ad...
WH
2010
13 years 2 months ago
2010
Ubiquitous physiological monitoring will be a key driving force in the upcoming wireless health revolution. Cardiac and brain signals in the form of ECG and EEG are two critical h...
ISCA
2011
IEEE
12 years 11 months ago
2011
IEEE
Emerging memory technologies such as STT-RAM, PCRAM, and resistive RAM are being explored as potential replacements to existing on-chip caches or main memories for future multi-co...