1476 search results - page 31 / 296 » Three-dimensional integrated circuits |
ICCAD
2007
IEEE
14 years 4 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
DATE
2002
IEEE
14 years 22 days ago
2002
IEEE
A unified approach to fault simulation for FGDs is introduced. Instead of a direct fault simulation, the proposed approach calculates indirectly from the simulator output the set...
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
A new approach in hierarchical optimisation is presented which is capable of optimising both the performance and yield of an analogue design. Performance and yield trade offs are ...
ISQED
2000
IEEE
2000
IEEE
A Layout Approach for Electrical and Physical Design Integration of High-Performance Analog Circuits
14 years 4 days ago
This paper presents a layout generation tool that aims to reduce the gap between electrical sizing and physical realization of high performance analog circuits. The procedural lay...
GLVLSI
2005
IEEE
14 years 1 months ago
2005
IEEE
—On-chip power distribution grids with multiple supply voltages are discussed in this paper. Two types of interdigitated and paired power distribution grids with multiple supply ...