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CHI
2001
ACM
14 years 9 months ago
DataTiles: a modular platform for mixed physical and graphical interactions
The DataTiles system integrates the benefits of two major interaction paradigms: graphical and physical user interfaces. Tagged transparent tiles are used as modular construction ...
Jun Rekimoto, Brygg Ullmer, Haruo Oba
ICCAD
2004
IEEE
114views Hardware» more  ICCAD 2004»
14 years 5 months ago
High-level synthesis using computation-unit integrated memories
Abstract— High-level synthesis (HLS) of memory-intensive applications has featured several innovations in terms of enhancements made to the basic memory organization and data lay...
Chao Huang, Srivaths Ravi, Anand Raghunathan, Nira...
MOBISYS
2009
ACM
14 years 9 months ago
R2D2: regulating beam shape and rate as directionality meets diversity
We design, implement, and evaluate a vehicular communication system that improves uplink connectivity through multi-lobe beam pattern switching on a smart antenna. Directionality ...
Kishore Ramachandran, Ravi Kokku, Karthikeyan Sund...
IEEEPACT
2008
IEEE
14 years 3 months ago
Pangaea: a tightly-coupled IA32 heterogeneous chip multiprocessor
Moore’s Law and the drive towards performance efficiency have led to the on-chip integration of general-purpose cores with special-purpose accelerators. Pangaea is a heterogeneo...
Henry Wong, Anne Bracy, Ethan Schuchman, Tor M. Aa...
DAC
2006
ACM
14 years 9 months ago
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...