In the last years, a progressive migration from single processor chips to multi-core computing devices has taken place in the general-purpose and embedded system market. The devel...
We examine the write endurance of USB flash drives using a range of approaches: chip-level measurements, reverse engineering, timing analysis, whole-device endurance testing, and ...
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultradeep submicrometer designs. To correctly predict performance/ leakage...
In this paper, we introduce a framework to estimate the power consumption on switch fabrics in network routers. We propose different modeling methodologies for node switches, inte...
The last few years have witnessed an unprecedented explosion in transistor densities. Diminutive feature sizes have enabled microprocessor designers to break the billion-transisto...