Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
— We discuss the design of CMOS MEMS in a 3D SOI-CMOS technology. We present layout architectures, preliminary mechanics modeling using finite element analysis and release proce...
Designers of SoCs with non-digital components, such as analog or MEMS devices, can currently use high-level system design languages, such as SystemC, to model only the digital par...
Ankush Varma, Muhammad Yaqub Afridi, Akin Akturk, ...
Reuse of existing code from class libraries and frameworks is often difficult because APIs are complex and the client code required to use the APIs can be hard to write. We obser...
We propose in this paper a multilevel full-chip routing algorithm that improves testability and diagnosability, manufacturability, and signal integrity for yield enhancement. Two ...