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DATE
2006
IEEE
152views Hardware» more  DATE 2006»
14 years 4 months ago
Adaptive chip-package thermal analysis for synthesis and design
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li...
ISCAS
2006
IEEE
121views Hardware» more  ISCAS 2006»
14 years 4 months ago
Microelectromechanical systems in 3D SOI-CMOS: sensing electronics embedded in mechanical structures
— We discuss the design of CMOS MEMS in a 3D SOI-CMOS technology. We present layout architectures, preliminary mechanics modeling using finite element analysis and release proce...
Francisco Tejada, Andreas G. Andreou
CASES
2006
ACM
14 years 3 months ago
Modeling heterogeneous SoCs with SystemC: a digital/MEMS case study
Designers of SoCs with non-digital components, such as analog or MEMS devices, can currently use high-level system design languages, such as SystemC, to model only the digital par...
Ankush Varma, Muhammad Yaqub Afridi, Akin Akturk, ...
PLDI
2005
ACM
14 years 3 months ago
Jungloid mining: helping to navigate the API jungle
Reuse of existing code from class libraries and frameworks is often difficult because APIs are complex and the client code required to use the APIs can be hard to write. We obser...
David Mandelin, Lin Xu, Rastislav Bodík, Do...
SLIP
2005
ACM
14 years 3 months ago
Multilevel full-chip routing with testability and yield enhancement
We propose in this paper a multilevel full-chip routing algorithm that improves testability and diagnosability, manufacturability, and signal integrity for yield enhancement. Two ...
Katherine Shu-Min Li, Chung-Len Lee, Yao-Wen Chang...