1052 search results - page 15 / 211 » Understanding POWER multiprocessors |
ICCAD
2008
IEEE
14 years 4 months ago
2008
IEEE
—Increasing power densities due to process scaling, combined with high switching activity and poor cooling environments during testing, have the potential to result in high integ...
CODES
2007
IEEE
14 years 1 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
ICPPW
2009
IEEE
14 years 2 months ago
2009
IEEE
—The increasing attention on global scheduling algorithms for identical multiprocessor platforms produced different, independently developed, schedulability tests. However, the e...
CF
2009
ACM
14 years 9 days ago
2009
ACM
Energy consumption and heat dissipation have become key considerations for modern high performance computer systems. In this paper, we focus on non-clairvoyant speed scaling to mi...
TC
2008
13 years 7 months ago
2008
The design and performance of next-generation chip multiprocessors (CMPs) will be bound by the limited amount of power that can be dissipated on a single die. We present photonic n...