The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
Tony F. Chan, Jason Cong, Joseph R. Shinnerl, Kent...
Placement is one of the most important steps in the RTLto-GDSII synthesis process, as it directly defines the interconnects, which have become the bottleneck in circuit and syste...
Jason Cong, Tim Kong, Joseph R. Shinnerl, Min Xie,...
XACML does not natively support RBAC and even the specialized XACML profiles are not able to support many relevant constraints such as static and dynamic separation of duty. Exte...
Intrusions impose tremendous threats to today’s computer hosts. Intrusions using security breaches to achieve unauthorized access or misuse of critical information can have cata...
Chuan Feng, Jianfeng Peng, Haiyan Qiao, Jerzy W. R...
Starting at the 65-nm node, stress engineering to improve the performance of transistors has been a major industry focus. An intrinsic stress source--shallow trench isolation (STI)...
Andrew B. Kahng, Puneet Sharma, Rasit Onur Topalog...